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| MCP111/112 Micropower Voltage Detector Features * Ultra-low supply current: 1.75 A (max.) * Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V, 4.38V and 4.63V * Resets microcontroller in a power-loss event * Active-low VOUT pin: - MCP111 active-low, open-drain - MCP112 active-low, push-pull * Available in SOT23-3, TO-92 and SC70 packages * Temperature Range: - Extended: -40C to +125C (except MCP1XX-195) - Industrial: -40C to +85C (MCP1XX-195 only) Description The MCP111/112 are voltage-detecting devices designed to keep a microcontroller in reset until the system voltage has reached, and stabilized, at the appropriate level for reliable system operation. These devices also operate as protection from brown-out conditions when the system supply voltage drops below a safe operating level. The MCP111 and MCP112 are available in eight different trip voltages. The MCP111 has an open-drain output with an activelow pin (VOUT). This device will assert VOUT when the voltage on the VDD pin is below the trip-point voltage. The MCP112 has a push-pull output and will assert an active-low signal (VOUT pin) when the voltage on the VDD pin is below the trip-point voltage. During operation, the output (VOUT) remains at a logichigh as long as VDD is greater than the specified threshold voltage. When VDD falls below the voltage trip point, VOUT is driven low. Applications * * * * Critical C and P Power-monitoring Applications Computers Intelligent Instruments Portable Battery-Powered Equipment Package Types SOT23-3/SC-70 Block Diagram VDD VOUT 1 MCP111/112 3 VDD Comparator + - Output Driver VOUT VSS 2 TO-92 Band Gap Reference VOUT VDD VSS VSS 2004 Microchip Technology Inc. DS21889B-page 1 MCP111/112 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/s All inputs and outputs w.r.t. VSS . . . . . -0.6V to (VDD + 1.0V) Storage temperature . . . . . . . . . . . . . . . . . . -65C to + 150C Ambient temp. with power applied . . . . . . . -40C to + 125C Maximum Junction temp. with power applied . . . . . . . . 150C ESD protection on all pins . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111), TA = -40C to +125C. Parameters Operating Voltage Range Specified VDD Value to VOUT low Operating Current VDD Trip Point MCP1XX-195 MCP1XX-240 MCP1XX-270 MCP1XX-290 MCP1XX-300 MCP1XX-315 MCP1XX-450 MCP1XX-475 VDD Trip Point Tempco Threshold Hysteresis (min. = 1%, max = 6%) MCP1XX-195 MCP1XX-240 MCP1XX-270 MCP1XX-290 MCP1XX-300 MCP1XX-315 MCP1XX-450 MCP1XX-475 Note 1: Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. TTPCO VHYS Sym VDD VDD IDD VTRIP Min 1.0 1.0 -- 1.872 1.853 2.285 2.262 2.591 2.564 2.857 2.828 2.886 2.857 3.034 3.003 4.314 4.271 4.561 4.514 -- 0.019 0.023 0.026 0.029 0.029 0.031 0.044 0.046 Typ -- -- <1 1.900 1.900 2.320 2.320 2.630 2.630 2.900 2.900 2.930 2.930 3.080 3.080 4.380 4.380 4.630 4.630 100 -- -- -- -- -- -- -- -- 1.75 1.929 1.948 2.355 2.378 2.670 2.696 2.944 2.973 2.974 3.003 3.126 3.157 4.446 4.490 4.700 4.746 -- 0.114 0.139 0.158 0.174 0.176 0.185 0.263 0.278 Max 5.5 Units V V A V V V V V V V V V V V V V V V V ppm/ C V V V V V V V V TA = +25C TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 TA = +25C (Note 1) Note 2 I RST = 10 A, V RST < 0.2V Conditions 2: DS21889B-page 2 2004 Microchip Technology Inc. MCP111/112 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111), TA = -40C to +125C. Parameters VOUT Low-level Output Voltage VOUT High-level Output Voltage Open-Drain Output Leakage Current (MCP111 only) Note 1: Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Sym VOL VOH IOD Min -- VDD - 0.6 -- Typ -- -- 0.1 Max 0.4 -- -- Units V V A Conditions IOL = 500 A, VDD = VTRIP(MIN) IOH = 1 mA, For only MCP112 (push-pull output) 2: VTRIP 1V VDD tRPU tRPD VOH 1V VOUT tRT VOL FIGURE 1-1: Timing Diagram. AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111), TA = -40C to +125C. Parameters VDD Detect to VOUT Inactive VDD Detect to VOUT Active Sym tRPU tRPD Min -- -- Typ 90 130 Max -- -- Units s s Conditions Figure 1-1 and CL = 50 pF (Note 1) VDD ramped from VTRIP(MAX) + 250 mV down to VTRIP(MIN) - 250 mV, per Figure 1-1, CL = 50 pF (Note 1) For VOUT 10% to 90% of final value per Figure 1-1, CL = 50 pF (Note 1) VOUT Rise Time After VOUT Active tRT -- 5 -- s Note 1: These parameters are for design guidance only and are not 100% tested. 2004 Microchip Technology Inc. DS21889B-page 3 MCP111/112 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111), TA = -40C to +125C. Parameters Temperature Ranges Specified Temperature Range Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 3L-SOT23 Thermal Resistance, 3L-SC-70 Thermal Resistance, 3L-TO92 JA JA JA -- -- -- 336 340 131.9 -- -- -- C/W C/W C/W TA TA TJ TA -40 -40 -- -65 -- -- -- -- +85 +125 +150 +150 C C C C MCP1XX-195 Except MCP1XX-195 Sym Min Typ Max Units Conditions DS21889B-page 4 2004 Microchip Technology Inc. MCP111/112 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111; see Figure 4-1), TA = -40C to +125C. 1.6 1.4 1.2 IDD (uA) IDD (uA) 1 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 140 -40 -20 0 Temperature (C) 4.0V 2.8V 2.1V 1.7V 1.0V 1.6 MCP111-195 5.5V 5.0V 1.4 1.2 1 0.8 0.6 0.4 0.2 0 MCP111-195 +125C +85C -40C +25C 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 FIGURE 2-1: (MCP111-195). 1.2 1 IDD (uA) 0.8 0.6 0.4 IDD vs. Temperature FIGURE 2-4: IDD vs. VDD (MCP111-195). MCP112-300 5.5V 5.0V 4.0V 2.8V 1.7V 2.1V 1.6 1.4 1.2 IDD (uA) 1 0.8 0.6 0.4 0.2 0 1.0 2.0 +85C -40C +25C +125C MCP112-300 0.2 0 20 40 60 80 100 120 -40 -20 0 1.0V 140 3.0 4.0 VDD (V) 5.0 6.0 Temperature (C) FIGURE 2-2: (MCP112-300). 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 IDD vs. Temperature FIGURE 2-5: IDD vs. VDD (MCP112-300). 1.6 MCP112-475 4.0V 2.8V 5.5V 2.1V 1.4 1.2 IDD (uA) 1 0.8 0.6 0.4 0.2 0 MCP112-475 5.0V IDD (uA) +125C +85C -40C +25C 1.7V 1.0V 20 40 60 -40 -20 80 100 120 140 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 0 Temperature (C) FIGURE 2-3: (MCP112-475). IDD vs. Temperature FIGURE 2-6: IDD vs. VDD (MCP112-475). 2004 Microchip Technology Inc. DS21889B-page 5 MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111; see Figure 4-1), TA = -40C to +125C. 0.120 1.950 1.945 1.940 1.935 1.930 1.925 1.920 1.915 1.910 1.905 1.900 1.895 0.050 VTRIP, V increasing 0.045 0.040 VHYS, Hysteresis 0.035 0.030 MCP111-195 0.025 max temp is 0.020 +85C 0.015 VTRIP, V decreasing 0.010 0.005 0.000 -60 -10 40 90 140 Temperature (C) 0.100 0.080 Hyst (V) VOL (V) 0.060 0.040 -40C +85C MCP111-195 VDD = 1.7V +125C VTRIP (V) 0.020 0.000 0.00 +25C 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195). FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V). 0.080 3.040 3.020 3.000 VTRIP (V) 2.980 2.960 2.940 2.920 2.900 VTRIP, V increasing Hyst (V) VOL (V) VHYS, Hysteresis MCP112-300 VTRIP, V decreasing -60 -10 40 90 0.100 0.098 0.096 0.094 0.092 0.090 0.088 0.086 0.084 0.082 140 0.070 0.060 0.050 0.040 0.030 0.020 0.010 MCP112-300 VDD = 2.7V +125C +85C -40C +25C 0.000 0.00 0.25 0.50 IOL (mA) 0.75 1.00 Temperature (C) FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300). 4.800 4.780 4.760 4.740 4.720 4.700 4.680 4.660 4.640 4.620 4.600 4.580 -60 0.180 VTRIP, V increasing VHYS, Hysteresis FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V). 0.050 0.040 Hyst (V) VOL (V) 0.030 0.020 0.010 0.000 0.00 +85C -40C +25C 0.170 0.160 0.150 0.140 MCP112-475 MCP112-475 VDD = 4.4V VTRIP (V) +125C 0.130 0.120 0.110 VTRIP, V decreasing -20 20 60 100 0.100 140 0.25 0.50 IOL (mA) 0.75 1.00 Temperature (C) FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475). FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V). DS21889B-page 6 2004 Microchip Technology Inc. MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111; see Figure 4-1), TA = -40C to +125C. 0.120 0.100 0.080 VOL (V) 0.060 0.040 0.020 IOL = 0.00 mA MCP111-195 VDD = 1.7 V IOL = 1.00 mA 3.150 3.100 VOH (V) 3.050 3.000 2.950 2.900 0.00 MCP112-300 VDD = 3.1V IOL = 0.75 mA -40 C +25 C IOL = 0.50 mA IOL = 0.25 mA +85 C +125 C 0.000 -40 0 40 Temperature (C) 80 120 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V). 0.080 0.070 0.060 VOL (V) 0.050 0.040 0.030 0.020 0.010 0.000 -40 0 40 Temperature (C) 80 120 IOL = 0.25 mA IOL = 0.00 mA IOL = 0.50 mA MCP112-300 VDD = 2.7V IOL = 1.00 mA FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V). 4.820 4.800 MCP112-475 VDD = 4.8V IOL = 0.75 mA 4.780 VOH (V) +25 C 4.760 4.740 4.720 4.700 +85 C -40 C +125 C 4.680 0.00 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V). 0.050 0.040 IOL = 0.75 mA MCP112-475 VDD = 4.4V FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V). 600 Transient Duration (s) 500 400 300 200 100 0 0.001 MCP112-475 MCP112-300 MCP111-195 IOL = 1.00 mA VOL (V) 0.030 IOL = 0.50 mA 0.020 IOL = 0.25 mA 0.010 IOL = 0.00 mA 0.000 -40 0 40 Temperature (C) 80 120 0.01 0.1 VTRIP(min) - VDD 1 10 FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V). FIGURE 2-18: (25 C). Typical Transient Response 2004 Microchip Technology Inc. DS21889B-page 7 MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111; see Figure 4-1), TA = -40C to +125C. 350 300 250 tRPD (s) 200 150 100 50 0 -40 -15 10 35 60 85 110 Temperature (C) VDD decreasing from: 5V - 0V VDD decreasing from: 5V - 1.7V 400 MCP111-195 MCP111-195 350 300 tRPU (s) VDD increasing from: 0V - 2.1V VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V 250 200 150 100 50 0 -40 -15 VDD increasing from: 0V - 2.8V VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 5.5V 10 35 60 85 110 Temperature (C) FIGURE 2-19: (MCP111-195). 160 MCP112-300 tRPD vs. Temperature FIGURE 2-22: (MCP111-195). 140 tRPU vs. Temperature 140 120 tRPD (s) VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V 120 100 tRPU (s) VDD increasing from: 0V - 3.1V MCP112-300 100 80 60 40 20 0 -40 VDD decreasing from: 5V - 2.7V 80 60 40 VDD increasing from: 0V - 3.3V VDD increasing from: 0V - 4.0V VDD decreasing from: 5V - 0V 20 0 VDD increasing from: 0V - 5.5V -15 10 35 60 85 110 -40 -15 Temperature (C) 10 35 60 Temperature (C) 85 110 FIGURE 2-20: (MCP112-300). 250 200 tRPD (s) 150 100 50 tRPD vs. Temperature FIGURE 2-23: (MCP112-300). 250 tRPU vs. Temperature VDD decreasing from: 5V - 4.4V MCP112-475 MCP112-475 200 tRPU (s) 150 100 50 VDD increasing from: 0V - 4.9V VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V VDD decreasing from: 5V - 0V 0 -40 -15 10 35 60 Temperature (C) 85 110 0 -40 -15 10 35 60 85 110 Temperature (C) FIGURE 2-21: (MCP112-475). tRPD vs. Temperature FIGURE 2-24: (MCP112-475). tRPU vs. Temperature DS21889B-page 8 2004 Microchip Technology Inc. MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111; see Figure 4-1), TA = -40C to +125C. 60 55 50 tRT (s) 45 40 35 30 25 20 -40 -15 10 35 60 85 110 VDD increasing from: 0V - 2.8V VDD increasing from: 0V - 2.1V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.0V 0.1500 MCP111-195 MCP112-475 0.1400 0.1300 tRT (s) 0.1200 0.1100 0.1000 0.0900 0.0800 -40 -15 10 35 60 85 110 VDD increasing from: 0V - 4.8V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.9V VDD increasing from: 0V - 5.0V Temperature (C) Temperature (C) FIGURE 2-25: (MCP111-195). 0.4 0.35 0.3 tRT (s) 0.25 0.2 0.15 0.1 0.05 0 -40 -15 tRT vs. Temperature FIGURE 2-27: (MCP112-475). tRT vs. Temperature VDD increasing from: 0V - 3.1V VDD increasing from: 0V - 3.3V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.0V MCP112-300 10 35 60 85 110 Temperature (C) FIGURE 2-26: (MCP112-300). tRT vs. Temperature 2004 Microchip Technology Inc. DS21889B-page 9 MCP111/112 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. SOT23-3 SC-70 1 PIN FUNCTION TABLE Symbol T0-92 1 VOUT Output State VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS Function 2 3 3 2 VSS VDD Ground reference Positive power supply DS21889B-page 10 2004 Microchip Technology Inc. MCP111/112 4.0 APPLICATION INFORMATION 4.1 VTRIP Operation For many of today's microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain SRAM, thus producing indeterminate results. Figure 4-1 shows a typical application circuit. VDD 3 VDD VDD RPU 1 PICmicro(R) Microcontroller MCLR (Reset Input) GND The voltage trip point (VTRIP) is determined on the falling edge of VDD. The actual voltage trip point (VTRIPAC) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). There is a hysteresis on this trip point to remove any "jitter" that would occur on the VOUT pin when the device VDD is at the trip point. Figure 4-2 shows the state of the VOUT pin as determined by the VDD voltage. The VTRIP specification is for falling VDD voltages. When the VDD voltage is rising, the VOUT pin will not be driven high until VDD is at VTRIP + VHYS. 0.1 F MCP11X VOUT VSS 2 Note 1: RPU may be required with the MCP111 due to the open-drain output. Resistor RPU is not required with the MCP112. FIGURE 4-1: Typical Application Circuit. VDD VTRIPMAX VTRIPMIN 1V VTRIPAC + VHYSAC VTRIPAC VTRIPAC VOUT < 1 V is outside the device specifications FIGURE 4-2: VOUT Operation as Determined by the VTRIP and VHYS. 2004 Microchip Technology Inc. DS21889B-page 11 MCP111/112 4.2 Negative Going VDD Transients 4.3 The minimum pulse width (time) required to cause a reset may be an important criteria in the implementation of a POR circuit. This time is referred to as transient duration and is the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time is dependant on the magnitude of VTRIP - VDD. Generally speaking, the transient duration decreases with increases in VTRIP - VDD. Figure 4-3 shows a typical transient duration vs. reset comparator overdrive for which the MCP111/112 will not generate a reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a reset gets shorter. Figure 2-18 shows the transient response characteristics for the MCP111/112. A 0.1 F bypass cap mounted as close as possible to the VDD pin provides additional transient immunity (refer to Figure 4-1). Effect of Temperature on Time-out Period (tRPU) The time-out period (tRPU) determines how long the device remains in the reset condition. This is affected by both VDD and temperature. The graph shown in Figures 2-22, 2-23 and 2-24 show the typical response for different VDD values and temperatures. 5V Supply Voltage VTRIP(MIN) - VDD VTRIP(MAX) VTRIP(MIN) tTRANS Time (s) 0V FIGURE 4-3: Example of Typical Transient Duration Waveform. DS21889B-page 12 2004 Microchip Technology Inc. MCP111/112 5.0 5.1 PACKAGING INFORMATION Package Marking Information 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP111 290E TO0405 256 3-Pin SC-70 Part Number MCP111T-195I/LB MCP111T-240E/LB MCP111T-270E/LB MCP111T-290E/LB MCP111T-300E/LB Example: SC-70 EPN EQN EGN EHN EJN EKN ELN EMN Part Number MCP112T-195I/LB MCP112T-240E/LB MCP112T-270E/LB MCP112T-290E/LB MCP112T-300E/LB MCP112T-315E/LB MCP112T-450E/LB MCP112T-475E/LB SC-70 ERN ESN EAN EBN ECN EDN EEN EFN Top Side MCP111T-315E/LB MCP111T-450E/LB MCP111T-475E/LB 3-Pin SOT-23B Part Number MCP111T-195I/TT MCP111T-240ETT MCP111T-270E/TT MCP111T-290E/TT MCP111T-300E/TT MCP111T-315E/TT MCP111T-450E/TT MCP111T-475E/TT Example: SOT-23 MPNN MQNN MGNN NHNN MJNN MKNN MLNN MMNN Part Number MCP112T-195I/TT MCP112T-240ETT MCP112T-270E/TT MCP112T-290E/TT MCP112T-300E/TT MCP112T-315E/TT MCP112T-450E/TT MCP112T-475E/TT SOT-23 MRNN MSNN MANN MBNN MCNN MDNN MENN MFNN Legend: 1 2 3 4 Part Number + temperature range and voltage (two-digit code) Part Number + temperature range and voltage (two-digit code) Lot ID number Year and work week Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. 2004 Microchip Technology Inc. DS21889B-page 13 MCP111/112 3-Lead Plastic Small Outline Transistor (TT) (SOT-23) E E1 2 B n p p1 D 1 c A A2 L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic B MIN INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21889B-page 14 2004 Microchip Technology Inc. MCP111/112 3-Lead Plastic Small Outline Transistor (LB) (SC-70) E E1 B 2 p1 D 3 1 p a c A A2 b L A1 Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8 8 MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12 12 MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8 12 8 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 2004 Microchip Technology Inc. DS21889B-page 15 MCP111/112 3-Lead Plastic Transistor Outline (TO) (TO-92) E1 D 1 n L 1 2 3 B p c A R INCHES* NOM MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 4 5 6 Mold Draft Angle Top Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 Units Dimension Limits n p MIN MAX MIN MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 DS21889B-page 16 2004 Microchip Technology Inc. MCP111/112 5.2 Product Tape and Reel Specifications EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape FIGURE 5-1: A0 W K0 B0 P TABLE 1: Case Outline TT LB CARRIER TAPE/CAVITY DIMENSIONS Package Type SOT-23B SC-70 3L 3L Carrier Dimensions W mm 8 8 P mm 4 4 A0 mm 3.15 2.4 Cavity Dimensions B0 mm 2.77 2.4 K0 mm 1.22 1.19 Output Quantity Units 3000 3000 Reel Diameter in mm 180 180 FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS Device Marking User Direction of Feed Pin 1 W, Width of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation 2004 Microchip Technology Inc. DS21889B-page 17 Device Marking MCP111/112 FIGURE 5-3: TO-92 DEVICES P, Pitch Device Marking 3 LEAD TO-92 W, Width of Carrier Tape Device Marking 2 LEAD TO-92 W, Width of Carrier Tape Standard Reel Component Orientation Reverse Reel Component Orientation H1 H H0 W6 D F1 F2 P2 P1 F DS21889B-page 18 2004 Microchip Technology Inc. MCP111/112 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X XXX X XX Examples: a) MCP111T-195I/TT: Tape and Reel, 1.95V option, open-drain, -40C to +85C, SOT-23B package. MCP111T-315E/LB: Tape and Reel, 3.15V option, open-drain, -40C to +125C, SC-70-3 package. MCP111-300E/TO: 3.00V option, open-drain, -40C to +125C, TO-92-3 package. MCP112T-290E/TT: Tape and Reel, 2.90V option, push-pull, 40C to +125C, SOT-23B-3 package. MCP112T-475E/LB: Tape and Reel, 4.75V option, push-pull, -40C to +125C, SC-70-3 package. MCP112-450E/TO: 4.5V option, push-pull, -40C to +125C, TO-92-3 package. Tape/Reel Monitoring Temperature Package Range Option Options b) Device: MCP111: MicroPower Voltage Detector, open-drain MCP111T: MicroPower Voltage Detector, open-drain (Tape and Reel) MCP112: MicroPower Voltage Detector, push-pull MCP112T: MicroPower Voltage Detector, push-pull (Tape and Reel) c) a) Monitoring Options: 195 240 270 290 300 315 450 475 = = = = = = = = 1.90V 2.32V 2.63V 2.90V 2.93V 3.08V 4.38V 4.63V b) c) Temperature Range: I E = -40C to +85C (MCP11X-195 only) = -40C to +125C (Except MCP11X-195 only) Package: TT = SOT-23B, 3-lead LB = SC-70, 3-lead TO = TO-92, 3-lead Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21889B-page 19 MCP111/112 NOTES: DS21889B-page 20 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. DS21889B-page 21 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, MA Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-750-3506 Fax: 86-591-750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Tel: 86-755-8290-1380 Fax: 86-755-8295-1393 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 ASIA/PACIFIC India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8632 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4816 Fax: 886-7-536-4817 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4420-9895 Fax: 45-4420-9910 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 08/24/04 DS21889B-page 22 2004 Microchip Technology Inc. |
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